I am going to see what I can round up and bring to Providence. I hope everybody else will also respond to the appeal Dave Hillman has made on behalf of Les and his committee. regards, Bev Christian Nortel > ---------- > From: David D Hillman[SMTP:[log in to unmask]] > Sent: Tuesday, July 14, 1998 9:33 AM > To: [log in to unmask] > Subject: Re: [TN] Provide me your current BGA Spec on void > > Hi Bev! Wow, there has been quite a bit of interest in the amount of > voiding allowable on BGA components on TechNet! The current ANSIJ-STD-001C > draft proposal has a new paragraph in section 9.2.6.9 titled Ball Grid > Arrays with the proposed voiding limits in Table 9-10 of 25% for Class1/2 > products and 10% for Class 3 type products. If people don't like those > numbers my suggestion is to get involved with the 001 specification > committee - bring test data to support your % void limits suggestions. > These current numbers originated from 2 data sets submitted and reviewed > by > a 001 subcommittee lead by Les Hymes. I know the committee would love to > have additional test data sets submitted to further support the % voiding > limit value discussions (for the current proposed values or any other > suggested values) . > > Dave Hillman > Rockwell Collins > [log in to unmask] > > > > > > Bev Christian <[log in to unmask]> on 07/10/98 09:16:26 PM > > Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please > respond > to Bev Christian <[log in to unmask]> > > To: [log in to unmask] > cc: (bcc: David D Hillman/CedarRapids/Collins/Rockwell) > Subject: Re: [TN] Provide me your current BGA Spec on void > > > > > Ken, > You mean to say you have customers knowledgeable enough that they know > they > should be asking for more than just the presence of a shiny fillet?!!! We > obviously give them more than that or we wouldn't still be in business, > but > I am truly surprised to hear you ask your question in terms of customer > knowledge. Of course what is worse is a customer that thinks he knows > what > he/she is talking about, but doesn't. A case in point is the new Bellcore > GR-78 that specifies an impossibly low void criteria for all joints. > > In response to the last question of this type Dave Hillman said more was > done at the last IPC meeting on this subject, but I don't recall what was > said specifically about size and % voiding? Dave, others? > > regards, > Bev Christian > Nortel > > > ---------- > > From: Ken Patel[SMTP:[log in to unmask]] > > Sent: Friday, July 10, 1998 6:21 PM > > To: [log in to unmask] > > Subject: [TN] Provide me your current BGA Spec on void > > > > Technetters, > > What is your current spec on accepting void in BGA joints? Are you going > > by > > spec of 10 mil, meaning void more than 10 mils is reject? What are your > > customers specifying in assembly drawings? > > > > > > re, > > ken patel > > ______________________________________________________ > > Ken Patel Phone: (408) 490-6804 > > 1708 McCarthy Blvd. Fax: (408) 490-6859 > > Milpitas, CA 95035 Beeper: (888) 769-1808 > > > > ################################################################ > > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > > ################################################################ > > To subscribe/unsubscribe, send a message to [log in to unmask] with > > following text in the body: > > To subscribe: SUBSCRIBE TechNet <your full name> > > To unsubscribe: SIGNOFF TechNet > > ################################################################ > > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > > section for additional information. > > For technical support contact Hugo Scaramuzza at [log in to unmask] or > > 847-509-9700 ext.312 > > ################################################################ > > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section > for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################