This may be of interest: Article, "Effects of gold diffusion on a near-eutectic solder joint," by Seth Enwright of Lockheed Martin, Hudson, NH. ...in Electronic Packaging & Production magazine, June 1998 issue, p. 68-72 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################