These caps cannot take the thermal shock associated with wave contact, they will fracture and/or come off the board. If you are finding them missing at ICT, they're in your solder pot chewing up your pump and bearings. If this has been an ongoing issue, you should probably drain/clean/refill your pot with new solder to prevent machine damage and solder contamination from the ground up ceramic bits. If you must put these on the bottom side of the board, look at: - Wave carriers that will mask these locations, and process them as reflowed parts, with paste rather than glue. You can selectively process just the large ceramics or all bottom side SMT, and have the carrier mask everything but the leaded components. - Do bottom side reflow of all SMT and process top side leaded components as pin-in-paste/intrusive reflow to eliminate wave completely. - As final consideration, hand solder them after wave if volumes are low enough to accomodate. If hand soldering, use a quality galvanic skin type soldering iron such as Me**al (careful avoidance of manufacturer 'plug'), to minimize the same thermal shock at hand solder. Mike McMonagle K*Tec Electronics > -----Original Message----- > From: Dhawan, Ashok [SMTP:[log in to unmask]] > Sent: Thursday, July 02, 1998 12:57 PM > To: [log in to unmask] > Subject: [TN] KEMET capacitor 2225 size --not suitable for wave > soldering??? > > Is there anybody having experience on Wave Soldering Ceramic > Capacitors > C2225C225M5UAC ? > We are using these caps on solderside of one of assembly (Gluing the > Components ) .We are finding some of caps blowing off at ATE. Our > manuf > engr is suspecting wave thermal shock /mech shock? > > KEMET has in one of their application notes mentioned that this part > should not be used for wave soldering. Special process profiles > required. Any recommendation for our wave soldering Process Engineer? > > I will appreciate if somebody can share experience on Technet and > provide info. > > thanks > > > > Ashok Dhawan P.ENG. > Manufacturing Engineering > Unisys Canada Inc. > 51 Burmac Road > Winnipeg R2J4C9 > CANADA > Fone 204-257-9199 > Fax 204-257-9104 > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################