Michael,

Dump point depends on type of solder strip you are using. Peroxide or nitric
based. Peroxide strippers exotherm when exposed to copper and will continue
to deterorate in concentration whether it is being used or not so time is as
much of a dump criteria as square feet run. Nitric strippers are not
commonly used in tab platers but are far more stable than peroxide and hold
50-100% more tin metal.
Since most production is smobc, most tin strips have become obsolete on the
tab plater since the tin is removed on the SES line that dilute sulfuric is
used in place to deoxidize and activate the surface. Contact me directly if
you would like to discuss in more detail.
-----Original Message-----
From: Michael D. Doty <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, July 01, 1998 9:41 PM
Subject: [TN] Dump Criteria for Solder Strip


>       I'm looking for dump criteria on solder strip in a Tab line. I
>     currently dump on board count but would like to know if 1.) There is a
>     copper concentration I could dump to or 2.) it is overkill?
>       I can't seem to get any info on this from vendors or other users.
>
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