Seems to be a fine (less than 1 mm pitch) BGA. People are assembling such parts with many many more bumps (tens to hundreds of bumps). One necessary advice I have seen worthy of note is that do not tweak placement manually before reflow. Syed. -----Original Message----- From: [log in to unmask] [SMTP:[log in to unmask]] Sent: Wednesday, July 15, 1998 12:32 PM To: [log in to unmask] Subject: [TN] Assembly unusual part? All, I have received a request from a customer to install an unusual package on their board. The package dimension is .85mm x .85mm (yes, millimeters) with four solder bumps. The solder bumps is .16mm - .18mm in diameter with a .5mm pitch. The part is .78mm thick. The material is silicon. Question 1: What do you call this type of package? Question 2: Is there a recommended assembly process? Here is my plan of action: 1. Get data on the type of solder bump 2. Use sticky flux and not paste to print 3. Use Machine or hand mount the component 4. Use X-ray to inspect for misaligment 5. Reflow and X-ray Thank you for your input! Tuan ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################