Hello, I am looking for a tinning service to deal with an SMT part best described as a ceramic SOJ-36. The part has side brazed, gold plated J-leads. The service should have extensive experience tinning SMT devices and dealing with coplanarity issues arising from uneven solder deposits during tinning. Any offers or recommendations are welcome, on-line or off-line. Additional details below for those interested. Steve Mikell SCI Systems Plant 13 (256)-882-4800 x9366 [log in to unmask] Problems 1. The metalization of the part extends onto the bottom of the part body. The end of the J-lead curls to within 0.010" of the bottom of the part. Per spec we need to remove the gold plating from the to be soldered surface, but we also need to not kill the what little stress relief this design offers by soldering the lead to the part bottom. 2. Coplanarity of the lead bottoms must not exceed a range of 0.005". A small blob of solder on the bottom of one lead may raise other leads out of the solder paste, resulting in solder defects. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################