Hi, There are two parameters that I should test before planning any press module for one of our application and hope getting some ideas from you: 1. What is the tolerance received in the thickness of the QPFP100 component after solder to the PC's pad? 2. What is the maximum press stress can provide to the same soldered component before getting any mechanical failure both of the component's leads or joint. Thanks Tamir. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################