The technologies for Future Electronic Modules and Electronic Assemblies is HERE and NOW! On Tuesday and Wednesday, June 10th and 11th CCA will be sponsoring a "High Density Interconnection Electronic Modules and Assemblies" Workshop in San Jose, California. You should have received information on this important workshop in the mail but incase you missed it here is your opportunity to register for this important event. Our biggest challenge is to get smaller! As the boom in portable, consumer electronics grows, the pressure to shrink conductor widths, land pattern geometries and hole sizes also continues. This workshop provides an overview of the technology involved in high-density interconnection. This program will be an interactive exchange of ideas on design, materials, fabrication, assembly and test procedures. Dieter Bergman and Foster Gray will moderate this two day workshop. With over 42 years in the industry they will be able to provide attendees with a wealth of knowledge regarding all facets regarding HDI. To receive a complete brochure on this conference please call CCA at (714) 730-4586 and speak with Dennis Maggi, but don't wait as time will pass you by and so with this opportunity to learn more about HDI. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################