Gabriela Bogdan wrote: > > Hi, TechNetters! > Could you please share with me your experience about pro and con's > regarding solder mask > between fine pitch-16mil- pads in relation to the finish of the PCB pads > ? > Not being greedy, I'll save the next question for after some answers. > Thank you, > Gaby > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ Gaby - I strongly recommend solder mask (LPI) between the pads on all fine pitch. Seveal years ago, we designed a process development test board which had both "pad windows" (no mask between pads on one side of a QFP footprint) and mask between pads. The QFP's and pad windows were in different orientations on the same board. The results were that we had significantly less bridging with mask between the pads. For the last few years, we have assembled .016 mil parts with mask between the pads. You may want to consider another PC Board fabricator. Ed Valentine/ -- ProTronics, Inc. 861 Old Knight Road Knightdale, NC 27545 Phone: (919) 217-0007, Fax: (919) 217-0050 http://www.protronics-inc.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################