Alex, The manufacturers of these type poly bags use an amino-acid, which some have eluded to as "Fatty substance" correctly. The amino acid was used as a release agent to prevent the bags from sticking together from electrostatic attraction. We researched the field and found other anti-static bags that did not contain the amino-acids. I do not recall whose bags we ended up with and the one who purchased these bags is no longer here. The pink bags did definitely affect the solderability. Les Connally [log in to unmask] > From: Alex Neussendorfer <[log in to unmask]>, on 6/4/98 12:44 PM: > The pink bags are death on wire-bondable gold. It's my understanding that > they contain a fat type substance. Perhaps this is what you see. > > ---------- > > From: Mike Bailey <[log in to unmask]> > > To: [log in to unmask] > > Subject: [TN] Anti-Static Bags > > Date: Thursday, June 04, 1998 9:33 AM > > > > Has anyone experienced problems with packaging bare PCB's in the pink > > anti-static bags? We are seeing a "waxy"image transfer from the bag to > > the panel after what appears to be several months of storage in a > > controlled atmosphere. It is aggravated by stacking individually > > packaged boards on top of each other and has occurred on several > > different surface finishes. The substance can also be found on the > > non-board side of the bag. Does anyone know of what the coating might > > be comprised? Would you predict solderability issues etc? > > > > ################################################################ > > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > > ################################################################ > > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > > To subscribe: SUBSCRIBE TechNet <your full name> > > To unsubscribe: SIGNOFF TechNet > > ################################################################ > > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional > information. > > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > > ################################################################ > > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional > information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################