Hello everyone ! We are experiencing here some solder quality problem after our solder reflow process. The quality of the solderability of components spcecifically the QFP IC's was not that good. The formation of the solder fillet was convex on the IC leads which sometimes looks to be grainy and sometimes it looks to be that the solder paste has suddenly stop from flowing to its desired area. We already checked the profile parameters of our reflow process and it is within the specs limit of the solder paste that we are using. Do you think that the thawing time of the solder paste have something to do with this kind of problem ? Thank you in advance to anyone that could give a solution to this problem. Regards, Ricky Electronics Assemblies, Inc. Phils. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################