Hi everyone, I am using an epoxy dispensing machie that performs potting on metal scases. One of my biggest problem is the occurrence of bubbles after dispensing. The machine has its own vacuum for the chemicals before mixing. But the dispensing stage is done on room parameters. Bubbles occur before and after oven curing. Can this occurrence of bubbles be controlled? Or to we need a vacuum verger during dispense? I would also like to ask for the standard soldering iron temperature used for rigid PCBs and flex PCBs. Regards. Jon Cruz OIC Supervising Product Engineer Electronic Assemblies Inc. [log in to unmask] tel.# 823-7317/7593884 fax# 8238326 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################