Hello everybody, We are processing chip-on-board devices and want to conduct die shear sampling test before wirebond , The specs should conform with the Mil.Std-883 D but unfortunately I don't have the hardcopy of it for my reference . Actually we already placed an order for this one but according to our purchaser Mil.Std.-883D is out of the market. Could anyone can help us on how we can get a copy of it so that we can follow / implement the specs in our process once we required by our customer . I understand that for every die size there should have a corresponding die shear limit and that is what we are missing right now . I want to give you some die sizes : 68 x 74 ,151x137 ,235x173 mils, Your help is highly appreciated,Thank you very much. Regards ricky ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################