Hi, A common practice post assembly of portable electronics is to conduct a 3-feet drop onto concrete.... I have a PCMCIA assembly onto which we are require to perform that test.... and I have some questions related to that..... Since my cards are only 24 mils thick or so and very light, I would like to know if the way that the assembly hits the floor is an issue, i.e hits on one of the corners vs. on its backside.... is there a widely accepted procedure that I could obtain a copy that would clarify this issue.... Thanks, Marcelo ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################