Hi,

A common practice post assembly of portable electronics is to conduct a 3-feet
drop onto concrete.... I have a PCMCIA assembly onto which we are require to
perform that test.... and I have some questions related to that..... Since my
cards are only 24 mils thick or so and very light, I would like to know if the
way that the assembly hits the floor is an issue, i.e hits on one of the corners
vs. on its backside.... is there a widely accepted procedure that I could obtain
a copy that would clarify this issue....

Thanks,

Marcelo

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################