Board finish? Let me guess.... Entek? -----Original Message----- From: McMonagle, Michael R. [mailto:[log in to unmask]] Sent: Thursday,June 25,1998 3:30 PM To: [log in to unmask] Subject: [TN] Poor Solderability on TSOPs I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything else on the board such as chips, j-leads and standard QFPs look good, shiny and well wetted. We are using fresh aqueous paste (Alpha WS609) and a fairly standard profile. Is there some inverse relationship between component/lead mass and thermal absorption that I am missing here? Any inputs would be greatly appreciated. Mike McMonagle Process Engineering Supervisor K*Tec Electronics Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 281-243-5639 Phone 281-527-1726 Pager 281-243-5539 Fax ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################