Experts, I am currently getting alot of failures at my functional tester. At my post solder station, I am noticing strings of dross across the pins of connectors. We are having to dedross the pot daily....for a no-clean process and inerted atmosphering, I think this is a bit extreme. Once, an operator managed to accidently put stencil cleaner in the flux....could this cause a reaction unable to be corrected without dumping the pot and cause excess dross. I initially thought we had too much exhaust drawing all nitrogen away from the wave. Our flux manufacturer did analyis and has determined that it's not the residues left which is causing my bridges at functional. Is a type 'C' solder analysis going to tell me anything of significance to my problem from any of your experiences? Any suggestions???? Jason Smith Process Materials Engineer Lexmark Electronics ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################