Hi Rob - and there are a multitude of reference sources that show solder dipped terminations are better than tin/lead plated terminations! If you were needed coplanarity then a plated termination would be better than a dipped termination. If you want solderability then (IMHO) a dipped termination would be better than a plated termination. There is an IPC technical report (IPC-TR-465-3) that the 002/003 committees completed that shows some very interesting data of how a tin/lead plated finish ranks with other alternative finishes (e.g. gold) in terms of steam aging resistance. My experiences have shown that dipped (or fused) finishes had better oxidation resistance than plated finishes but the TR-465-3 report illustrates how a plated finish can be very robust. Storage conditions, flux choice, and soldering process are other factors which can impact which finish would be preferred. Good topic for the TechNet - which finish do you prefer and why : dipped or plated. Dave Hillman Rockwell Collins [log in to unmask] Rob Schetty <[log in to unmask]> on 06/24/98 07:02:18 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Rob Schetty <[log in to unmask]> To: [log in to unmask] cc: (bcc: David D Hillman/CedarRapids/Collins/Rockwell) Subject: Re: [TN] Chip Termination Finish There are a multitude of reference sources showing that tin-lead plated terminations are much better than solder dipped. Rob Schetty LeaRonal Inc Freeport, NY USA -----Original Message----- From: Tom Lambert <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Wednesday, June 24, 1998 1:16 PM Subject: [TN] Chip Termination Finish >Hi Folks : I just know many of you out there have knowledge re termination >finish of chip parts to pass along. Specifically - is "hot solder dip" any >better/worse than "solder plate" ?? Thanx. > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 >################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################