We are currently performing wire bonding on a substrate for a particular customer. Generally this is gold wedge bonding at .7 mil find pitch. We want to expand that operation and do small volume, high mix of custom IC's (monolithic and some hybrid) built to an engineer's specs. These would be in the 1 - 200 volume for prototype or quick turnaround. We also want to know what other niches are open to us with our quality wire bonding capability and how to market them and to whom (chip on board, etc..) Any suggestions from those who have had success or who see a need that has not been met would be greatly appreciated. Thank you in advance for any help or thoughts! Bryan Bloom G&M Assembly [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################