Hi Guys, I am looking for some tidbits of info, mainly, I think, from folks in the component (IC) fab business. We are proposing a mod to a completed circuit card whereas we need to insert a resistor between a thru-hole DIP lead and another part. We would like to cut the DIP lead flush to the board on the component side, bend the lead out about 45 degrees, and hook and solder the jumper lead to it. (There are reasons we can't get to the back side of the board). The two concerns are lead breaking and compromising the hermeticity of the package. I know the glass frit is pretty tough, so do we have a good safety margin after this mod? tia (thanks in advance) Ralph ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################