We are currently planning implementation of a no-clean process and a few questions have come up. What should the shelf life policy be to assure solderability of components when soldered with no-clean fluxes? Do manufacturers tend to allow the same shelf life regardless of the flux? Does it make a difference if nitrogen purge is used? If so, what is the difference in the required? Thanks in advance REGARDS Sherman Banks [log in to unmask] 408/481-6047 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################