We are currently planning implementation of a no-clean process and a few
questions have come up.

What should the shelf life policy be to assure solderability of
components when soldered with no-clean fluxes?

Do manufacturers tend to allow the same shelf life regardless of the
flux?

Does it make a difference if nitrogen purge is used?

If so, what is the difference in the required?

Thanks in advance
REGARDS
Sherman Banks
[log in to unmask]
408/481-6047

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