Preferred method of surface prep is dry film dependent. Some films adhere
best via mechanical bond (scrub) others prefer chemical bond
(antitarnishes). Check with dry film supplier for their recommendation. With
proper rinsing and neutalization after e-less followed by a good antitarn
should produce best results. Only concern is hold time between after eless
and prior to dry film lamination. You should not scrub if you do not need to
for fear of possible over scrub resulting in rim voids at knee of the hole.
Scrubbing also introduces unecessary mechanical stress.
-----Original Message-----
From: Jacob Ransborg <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, June 17, 1998 6:32 PM
Subject: [TN] Cleaning Process after Electroless copper


>Hi technetters
>
>I would like to hear if anybody have experience wtith a cleaning process of
>PCB-boards after plating with electroless copper. Does anybody brush the
>boards or use a chemical treatment etc.
>
>
>Regards
>
>Jacob Ransborg
>
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