Hi,TechNetters! I am trying to find the cause for bond failures between the diode and the lead after reflow soldering of smd optocouplers.The failed components are DIP's-modified for SMT. I am thinking about: -Profile-the data sheet says only :lead soldering temp:max 260C for 10 sec. -Drying??? -General incompatibility with the process? The failure was detected at electrical testing and verified by X-ray too-I saw the broken wire at the wedge bond heel on the lead. Has anyone ever had a similar problem? Gaby ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################