howdy folks!

can anyone explain the possible causes in a manufacturing process that
would result in interplane separation when the boards are thermal
stressed??
the glass transition rating of the laminate material is 170-180 (FR4-06)
and the temperature cycle parameters are: -40 C to +50 C with a 6 degree
/min rate of rise, on hour dwell at the extremes, and 12 hour total
cycle time.

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