Hi Steve, thank you for your comment! What I really want to know is the
reliability of the product by using immersion gold PCB, including solder
joint reliablity and integrity of the PCB after process. Do you know whether
IPC has any standard or publication on this topic? Is it Bellcore compliant?
What is the issue with BGA for immersion gold?

Thanks again!

Fulton Feng

> ----------
> From:
> "STEVE_O\\'HARA"@HP-Vancouver-om10.om.hp.com[SMTP:"STEVE_O\\'HARA"@HP-Vanc
> ouver-om10.om.hp.com]
> Sent:         Wednesday, May 13, 1998 10:01 AM
> To:   Feng, Fulton [MPK:5221:EXCH]
> Cc:   [log in to unmask]
> Subject:      Re: [TN] Reliability of Immersion Gold PCB
>
>      What do you want to know??
>
>      Raw Board Reliability (solderability)
>      Contact Resistance Reliability?
>      Solder Joint Reliability
>
>      With regards to Solder Joint Reliability, the solder interface of the
>
>      nickel to solder forms tin intermetallics which will not be as strong
>
>      as solder to solder. These joints will still be acceptable for most
>      smt components but immersion gold and BGA's should be avoided.
>
>      Regards:
>
>      Steve O'Hara  HP
>
>
> ______________________________ Reply Separator
> _________________________________
> Subject: [TN] Reliability of Immersion Gold PCB
> Author:  Non-HP-Fulton.Feng.ffeng ([log in to unmask]) at
> HP-Vancouver,mimegw10
> Date:    5/12/98 5:39 PM
>
>
> Hi
> Has anyboy done any reliability study on Gold Immersion PCB finish?
>
> Thanks
> Fulton Feng
>
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