All, There was an interesting article in the February issue of SMT Magazine (IHS Publishing Group) on page 56, entitled: "End Paste Defects with Solid Solder Deposits". This is a technique where the PWB Manufacturer applies solder to the board, then runs the boards through polished rollers to flatten the solder coating into a flat surface roughly the same height as the soldermask. Then a tacky flux is applied and finally an easy peel cover sheet. They claim the boards retain solderability well and the paste stencil process is eliminated. There have been similar / identical techniques touted in the past, known as: "Sipad" (R) Siemens AG, (solderpaste application method) "Optipad" (R) Viele Circuits Inc. and Burkle USA, (liquid solder application method) and "Precision Pad Technology or PPT (R) Mask Technology Inc. (solderpaste application w/ textured finish) If anyone knows of domestic (USA) Manufacturers offering this technology, I'd like to hear who they are. Thanks Best Regards, Scott Lolmaugh SMT Production Engineering Honeywell IAC, Inc. 602.313.3551 /FAX: 3402 (Please call first) -----Original Message----- From: [log in to unmask] Sent: Wednesday, May 13, 1998 8:39 AM To: [log in to unmask] Subject: [TN] HASL alternatives To All, We are now making a comparison between different alternatives to HASL. The chosen alternative will have to meet the following criterias criterias. - flat coating - compatible with No-clean process and mixed technology - resistant to 2-3 reflow (multiple heat cycle) -and MINIMUM 1 year shelf life (storage before assembly) These are the alternatives we think can meet our needs: * OSP - Benzimidazole (?) * IMMERSION - Silver - Bismuth - Au-Ni - Palladium Q: Wich one do you think could be the best meet to our criterias ? Q: And what would be its advantage(s) compared to the others ? Q: OTHERS ? (is anyone using other coating alternative ) Thanks for all for your help Nicolas van der Heyden ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################