Hi, we are planning to start assembling PCBAs with the following technologies: * 25mil SMT connectors * 16mil TQFPs (14mm package) * 0402 chips I'm interested in knowing what kind of placement/soldering defect levels are associated with each of these packages. Any help would be appreciated. Yves Trudell Nortel, Wireless Networks Calgary Quality System Engineering ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################