Dave- Can you shoot me a copy too? 4Fax: 408-321-4549 thx, Dr. Bill Davis > -----Original Message----- > From: David Gonnerman [SMTP:[log in to unmask]] > Sent: Wednesday, May 27, 1998 7:33 AM > To: [log in to unmask] > Subject: Re: [TN] Reflow Atmosphere > > Hi Steve: > > Send me your fax number and I will fax "Nitrogen for Flow and Reflow > Soldering?" by Armin Rahn, Rahn-Tec Consultants. He wrote this last year > for the SMTA newsletter. > > Regards, > > -David > > > At 12:37 PM 5/26/98 -0600, you wrote: > >All, > > > >We are just getting into volume SMT production and I have a > >couple of questions about the benefits of a nitrogen reflow. > > > >1) Is there a suggested SMT pitch that almost necessitates > >the use of nitrogen (i.e. 20 mil does fine without but 16 > >mil needs it...)? > > > >2) If we are using 100% mil-std finish parts, boards, and > >RMA flux solder paste, are the benefits as great as if we > >were using commercial parts, boards, and a no-clean flux > >solder paste? > > > >3) One of our customers claims that it increases the life > >of the assembly by eliminating/reducing void formation > >within the solder connection. Any insight into this? > > > > > >We are in process of qualifying our SMT equipment, materials > >and processes. Any suggestions, insight, or lessons learned > >would be greatly appreciated. > > > >Thank you all in advance of your help!! > > > >Steve McBride > >[log in to unmask] > >(405) 624-5281 > > > >################################################################ > >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > >################################################################ > >To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > >To subscribe: SUBSCRIBE TechNet <your full name> > >To unsubscribe: SIGNOFF TechNet > >################################################################ > >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional > information. > >For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > >################################################################ > > > > > > David Gonnerman > Director of Publications > > Plan now to attend: > Surface Mount International (San Jose, CA; 8/23-8/27) > Electronics Assembly Expo (Providence, RI; 10/24-10/29) > > SURFACE MOUNT TECHNOLOGY ASSOCIATION > Enabling members to achieve success > in surface mount and companion technologies > through education, training and access to knowledge. > > 5200 Willson Road, Suite 215, Edina, MN 55424-1343 > 612-920-7682 F 612-926-1819 > [log in to unmask] www.smta.org > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################