I would be happy to participate. Please let me know. Jim =============================== Jim Maguire Senior Principal Engineer Boeing Information Space & Defense Systems PO Box 3999 M/S 3W-97 Seattle, WA 98124-2499 Phone (253)657-9063 Fax (253)657-8903 Pager (206)982-3737 Email: [log in to unmask] ================================ > ---------- > From: Jack Crawford[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Jack Crawford > Sent: Thursday, April 02, 1998 3:09 PM > To: [log in to unmask] > Subject: [TN] Invitation to Participate in Cleanliness Assessment > Study > > Ladies and Gentlemen of TechNet: > > The IPC Bare Board Cleanliness Assessment Task Group 5-32C is > conducting a > correlation study between different ionic cleanliness test methods > used to assess > bare board cleanliness. Details of the proposed study can be found in > the October > minutes of this task group from the IPC archives (www.ipc.org). This > testing is > being done to examine ionic cleanliness levels between the existing > ROSE test methods > and three other methods which are increasing in use for bare board > testing. > > Fabricators are invited to participate in this study. All data will > be held as > confidential and will be presented in a coded format. Each fabricator > will be > presented with their own data set. The results of the entire study > will be published > as an IPC Technical Report. We are currently limiting the scope of > the study to 20 > fabricators. First come, first served. > > For each participant, I request that a technical contact be given for > each > fabrication site and that the test boards chosen conform to the > following > requirements. These are chosen to minimize some sources of > variability. > > 1. The samples should be from a single facility, single fab line, > single lot of > material, single configuration (no mish mash of different factors). > 2. Board size should be no smaller than 4 x 4 and no larger than 8x10. > 3. Board should be solder masked (properly cured) and tin-lead coated, > epoxy-glass > laminate. > 4. Test boards should be from the standard process, no special > attention (e.g. 20 > passes through a cleaner to look better). > 5. Boards to be wrapped in IPA cleaned aluminum foil or sealed Kapak > bags for > shipment. > 6. All boards sent to CSL. They will be returned and the tests are > non-destructive. > 7. All data will be coded. Only Wittmer and Pauls will have the code. > > > We will need a total of 15 test boards. If desired, the boards may be > scrap for > reasons of misregistration, cracked copper, etc. It should not be for > reasons of bad > mask or mask cure or cleanliness. The 15 boards will be tested as > follows: > > · 3 samples - Standard ROSE per IPC Test Method 2.3.26.1 > · 3 samples - modified ROSE per the proposed IPC Test Method 2.3.25.1 > · 3 samples - ion chromatography per Delco Electronics C-7000 method > · 3 samples - ion chromatography per IPC Test Method 2.3.28 (CSL > standard) > · 3 samples as reserve, possibly for SIR testing later > > The boards should be accompanied by a process history, indicating > things like solder > mask used, HASL flux or fusing fluid used, laminate type, etc. We > want to know as > much about the history as possible. We understand the proprietary > nature of many > fabrication processes. This will be respected. > > Please contact me or Jack Crawford at IPC ([log in to unmask] OR > 847.509.9700 x 393), if > you wish to participate. Any questions should be directed to me. > > Sincerely, > > Doug Pauls > Technical Director > Contamination Studies Laboratories > 201 East Defenbaugh St. > Kokomo, IN 46902 > P: 765-457-8095 > F: 765-457-9033 > E: [log in to unmask] > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for > additional information. > For the technical support contact Dmitriy Sklyar at [log in to unmask] or > 847-509-9700 ext.311 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################