Hey all - Regarding articles on Paste-in-hole, Reflow of Through-hole (or whatever you wish to call it) - You can find the paper that Joe and I co-authored (a slightly later revision of it) on my webpage under articles at www.ITM-SMT.com. It is entitled Reflow of Through-hole and it contains the formulas we worked up independently and coinicidentally. It also has the formula for double-sided reflow. It previously appeared in the Sept. '96 issue of Circuits Assembly. I might also add, that in my experience, leads can protrude from the board, but you should keep the protrusion under 0.050", with under 0.030" preferred. Of course the paste should not dry out - it shouldn't anyway regardless of whether you're doing Reflow of Through-hole or just good ol' SMT. Also, inserted components should have a stand-off of at least 0.012" above the board. In addition to our paper, you might also get a copy of Bill Barthell's (Plexus) excellent work as well as that of Bob Willis of the SMART Group (UK). Also Martha Rupert's article on AMP's webpage is another resource. I share Kathy P's exhuberance for the process, too! Regards, Phil Zarrow ITM, Inc. Durham,. NH USA www.ITM-SMT.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################