This one's easy... Gold plate after copper plate for your "thin" requirement for soldering, then put another image on top of that to expose the areas needed for "thick" gold for wirebonding. ______________________________ Reply Separator _________________________________ Subject: [TN] Assy: Another gold/solder question Author: Glenn Pelkey <[log in to unmask]> at SMTPLink-Hadco Date: 4/28/98 9:40 AM Hello all, Adding to the discussion of gold embrittlement, how would you address the issue of maximizing gold thickness for wirebonding and minimizing gold thickness for soldering operation on the same board surface? In Table 3-2 of IPC-6015, there is an acceptable range for Class 1 and 2 that can be worked in, but with Class 3 there isn't. Maybe that's my answer...work in Class 1 or 2 only, specify gold thickness, verify content, and establish influence on solder joint integrity with respect to user environment. Has anyone else had to address this? Glenn Pelkey Maxtek Components Corp. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################