We are currently fabricating 8- to 14-layer boards for one of our customers; most of the internal layers of these boards are 2 oz. (.0028" nominal thickness) copper foil. This amount of total copper thickness within the board cross-section causes throughput and yield challenges at drilling. Our request to remove nonfunctional pads has raised the traditional concern of plated through hole reliability with versus without nonfunctional pads. 1) Can anyone point me to documented reliability test results (temperature cycling) that support the removal of nonfunctional pads in multilayer PWBs? 2) Since I haven't obtained my copy of IPC-2222 yet, will someone tell me if the wording from IPC-D-275 (Paragraph 5.3.2.5 Nonfunctional Lands) has been changed in IPC-2222? Regards, Dave Wolf HADCO Corporation 612/893-1466 [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################