Emily E Hoffman wrote: > SMTA/IMAPS EXPO 98 - DALLAS > Technical Symposium and Exhibition > April 27-28, 1998 > > Plano Convention Center > 2000 E. Spring Creek Parkway > Plano, TX (Just East of 75) > > EXHIBITS: APRIL 28, 11:00 AM TO 6:00 PM > FREE & OPEN TO ALL WHO REGISTER > (Registration form at end of e-mail) > > KEYNOTE ADDRESS: April 28 12:00 > "Trends in High Pin-Count Device Packaging" > presented by Jan Vardaman of Techsearch International Inc. > > FREE SMTA TECHNICAL SESSIONS April 28 > Technical Sessions: 8:30-11:30 & 1:30-3:30 > 8:30am Design for Manufacturing a Global Manufacturing Solution > Lease vs Purchase Analysis > Outsourcing versus Buy > Managing Moisture Sensitive SMT Components > 1:30pm An Awareness of ESD > Design for Ergonomics > SPC in the SMT Environment > Ball Grid Array Rework and Repair > > FREE IMAPS TECHNICAL SESSIONS: April 28 > 8:30-9:00am "Solder Bumping in Inert Atmosphere" > 9:00-12am Wafer/Die Bumping paper & panel discussion > 1:30-3pm Wafer/Die Placement, Inspection & test panel discussion > 1:30-5pm Wireless Technologies > > *** OVER 70 EXHIBIT TABLES IN THE ELECTRONICS MFG BUSINESS *** > FREE TO ATTENDEES > 1:00 AM - 6:00 PM April 28 Only > > *** DOOR PRIZES *** > > *** COMPLIMENTARY REFRESHMENTS *** > > REGISTER BY APRIL 21th for the Courses, Technical Sessions or Exhibits to be > entered into a DRAWING for a FREE 3COM Professional PALM PILOT. > > =============================================================== > Co-sponsored by the North Texas Chapters of: > The Surface Mount Technology Association (SMTA) > and > The International Microelectronics and Packaging Society > (IMAPS formerly ISHM & IEPS) > > =============================================================== > 1998 EXPO Exhibitors (as of early April 1998) > > Acudata > Advanced Ceramics > Axcess Technologies, LLP > Brady USA, Inc. > Circuit Design Specialties, Inc. > Circuit Technology Inc. > Coors Ceramics Company > Copelco Capital > D.G. Marketing > DeForest Sales Company > Dossett Industrial Sales > DuPont Electronics > Eastern Smelting & Refining Corp. > Ed Wuermser Associates > Epoxy Technology > Fine Line Stencil > Gannon & Scott, Inc. > Indium Corp. of America > Interfet > Leeds Instruments > Merino Sales Company > Nove reps, Inc. > PAC > PPI Adhesive Products Corp. > Prime Distributing Company > Process Sciences, Inc. > PSI International > Quadtek > Raytheon Company Adv. Mult. Inter. > Scientific Sealing Technology > SMEC. Inc. > Sonoscan, Inc. > Specialty Bags Corporation > Specialty Photo-Etch, Inc. > Spectra Sales Corporation > Speedy Circuits > Southwest Systems Technology > Teamco Factory Automation Systems > Teledyne Microelectronics > Texsource > Thinking Productivity, Inc. > Torenko & Associates > Unicircuit > V-Tek, Inc. > W.L. Gore & Associates > Westak > Williams Advanced Materials > Zuken-Redac > > For more information see http://www.smta.org > > *Attendee Registration Form* > > To register, please fill out the form below completely and mail to: > > Michelle Dossett > Ceramic Solutions > 229 Seegers Drive > Arlington, TX 76018 > > or fax to: > > Gary Tanel > Raytheon Systems Company > fax (972) 462-2140 voice (972) 462-2240 > > Name: _____________________________________________________________ > > Company: ________________________________ Title: ___________________ > > Address: ____________________________________________________________ > > City: _______________________________ State: _______ Zip: ______________ > > Phone: _____________ Fax: ______________ e-mail: ________________ > > Affiliation: ___ IMAPS ____ SMTA ___ IEEE > > Are you interested in becoming an IMAPS member? _______ SMTA member? > > I would like to register for: > > ____ Free IMAPS Technical Sessions > > ____ Free SMTA Technical Sessions > > ____ Free Exhibits > > Enclose a fee for the Personal development courses only. > ___ PD1 - FUNDAMENTALS OF MICROELECTRONICS $250.00, > $30 Full Time Student, CEU Credit, A. Elshabini, PHD > April 27, 1:00 PM -- 5:00 PM > > ___ PD2 - CHIP TECHNOLOGY, BALL GRID ARRAY AND CHIP SCALE PACKAGING FOR HIGH > DENSITY AND MINIATURIZED ELECTRONICS $250.00, $30 Full Time Student, CEU > Credit, A. Elshabini, PHD > April 27, 6:00 PM - 9:00 PM > > __ PD3 - MULTICHIP MODULE TECHNOLOGIES AND > ADVANCED ELECTRONICS PACKAGING $250.00, $30 Full Time Student, CEU Credit, A. > Elshabini, PHD > April 28, 8:00 -- 12:00 NOON > > Contact Emily Hoffman at [log in to unmask] for removal from this list. Technical Symposium and Exhibition SMTA/IMAPS EXPO 98 - DALLAS April 27-28, 1998 Plano Convention Center 2000 E. Spring Creek Parkway Plano, TX (Just East of 75) SMT Abstracts (registration information for FREE technicals sessions in prior e-mail) KEYNOTE ADDRESS: April 28 12:00 "Trends in High Pin-Count Device Packaging" presented by Jan Vardaman of Techsearch International Inc. FREE SMTA TECHNICAL SESSIONS April 28 See abstracts below Technical Sessions: 8:30-11:30 & 1:30-3:30 8:30am Design for Manufacturing a Global Manufacturing Solution Lease vs Purchase Analysis Outsourcing versus Buy Managing Moisture Sensitive SMT Components 1:30pm An Awareness of ESD Design for Ergonomics SPC in the SMT Environment Ball Grid Array Rework and Repair ABSTRACTS The following are the summary for the SMTA sessions: Morning Session: 08:30 AM - 11:30 AM 1. Design for Manufacturing a Global Manufacturing Solution by Frank Henry and Cynthia Sutherland, DSC Communications. Organizations that embrace strategies of DFM reap the benefits of cost, cycle time and improved product quality. However, standard methods of implementing DFM are complicated. Gaining the confidence of the design community and executing to project needs is an important aspect. Establishing tools and strategies to enhance information flow and training are also key to the success of the program. This presentation will discuss the various tools and strategies required for a global manufacturing solution. 2. Lease vs Purchase Analysis by Al Hosack, Copelco This presentation is aimed at determining in which cases leasing will be most efficient method of acquiring your electronic manufacturing equipment. Topics will be discussed in simple laymen terms and include: When leasing makes economic sense, what types of lease programs are offered in the market, understanding the finance terms like return-on-equity, residual value, operating lease, capital lease etc. 3. Successful Outsourcing - panel discussion by Tom Moe, Second Source This discussion is for anyone exploring the outsourcing of assembly as well as small contractors who work with customers to develop board level specifications. Successful outsourcing requires significant planning, as well as communication of appropriate OEM resources to obtain high yield at minimum costs. By implementing a few simple checks and specifications, both small and large companies can compete very successfully. The session will be a primer, using a basic checklist approach enabling your company to enter the outsourcing frenzy without succumbing to the pitfalls of being dependent upon your vendor to, make your decisions, which is often the ticket for mediocre results. 4. Managing Moisture Sensitive SMT Components - Rene Totten, Alcatel Network Systems Many plastic components may be damaged by entrapped moisture during reflow process. Prevention of moisture-related component damage will involve design, purchasing, stocking, and assembly operations. this presentation will discuss the nature of moisture sensitivity, and recommended procedures to be used throughout the organization Afternoon Session: 01:30 PM - 05:00 PM 5. An Awareness of ESD, Dean Crews, Raytheon Systems Co., This paper is designed to review and emphasize the basics of electrostatic discharge. With reference from EIA-625 we will explore ESD packaging and handling requirements. How training enhances the correct attitude for handling and protecting ESDS parts and assemblies will be discussed. We will be using real life scenarios to discuss what role ESD audit performs for the manufacturing area. 6. Design for Ergonomics, Rick Cruise and Roger Frazier, Raytheon Learning Institute In this paper will be presented the important factors why ergonomic design principles should be included early in the concept development cycle and continue ergonomic evaluations of the design in the prototyping cycle. The benefits that will be noted during the manufacture and assembly will be discussed. 7. SPC in the SMT Environment, Robert Davis Controlling SMT, Wave Solder, Auto/Hand insert, and hardware placement can be controlled by numerous methods. We will discuss methods appropriate for these applications: x-bar charts, DOE, work instructions, FMEA, or traditional Lean Thinking techniques. Application of these various techniques and the benefits derived with respect to time and employee acceptance will be discussed. Included in the presentation will be suggestions for functional responsibilities in these applications. 8. Ball Grid Array Rework and Repair - Martin Roberts, PAC Rework and repair is an integral part of circuit card assembly. This paper addresses the BGA package removal and installation methodologies with emphasis on PWB and package, site preparation, and potential problems associated with the rework and repair processes. > > >