Tech netters, I am in need of your great wealth of experience and enginuity. The problem that I am experiencing is press fitting a solderless socket (Augat) into a plated through holes that are .050 on center. We've tried baking the board, using soap to eliminate friction and other imaginative ways of pressing these sockets into the holes with limited success. Our problem is not inserting the socket but, eliminating delamination from one hole location to another. I believe that IPC-610 allows for a 25% delam, measling of the pad. We are experiencing delam from hole to hole but not in all locations just, a few. Please, if any one has had this problem before I'd appreciate any feed back. Thanks, Paul ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################