Mike, The subsection table of contents for each section of IPC-TM-650 was just updated for the latest update (March 1998) of IPC-TM-650. In the update of the tables of contents, I removed the reference to Method 2.1.4, as well as the other 'planned for future release' test methods that were mentioned in other table of contents pages of IPC-TM-650. Susan Mansilla, chair of the Test Methods Subcommittee (7-11), and I felt that the 'planned for future release' methods that were listed did nothing but cause confusion. Those methods weren't even listed in my status of standardization for test methods, which I update on a regular basis. For a current listing of the test methods that are being worked on right now, I refer you to http://www.ipc.org/html/framesetcatseg.html, which offers the most up to date status of working test methods and IPC documents. This same listing can also be found in each issue of the IPC Review. If you can't access the information by either of the above means, please contact me directly. I would be more than happy to provide you with the list or answer any more of your questions. Regards, Chris Chris Jorgensen Project Manager IPC 2215 Sanders Rd. Northbrook, IL 60062-6135 -p- 847-509-9700 x.328 -f- 847-509-9798 [log in to unmask] http://www.ipc.org >>> Mike Johnson <[log in to unmask]> 04/07/98 09:09AM >>> Greetings to all, I have a question on the IPC-TM-650 test methods book. In section 2.1 visual, under 2.14 solder examination. This was printed as planned for future release. Does anyone have any information on this subject? The actual question I am trying to answer is as follows. Is there a minimum and maximum allowable solder coating thickness for surface mount pads? Also is there a surface insulation resistance specification? Thanks for your time in advance. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################