At 10:45 15/04/98 EDT, you wrote: >Hey you Tech Heads........Help > To : Brian K. Doughty Numonics Corporation I am note sure I understand You corectly . It seems to me You are tolking about two separate problems : pads under cut ( size reduction ) and dimension stability . 1 ) Pads undercut is completly controlable . Your PCB manufacturer shoul be able to deal with it like with " normal " rigid PCB . 2 ) Maybe You have a problem of pads size reduction due to uncontrolled flow of acrylic prepreg used for lamination of coverlay ? Uncontrolled movement of coverlay ? You have to look on the board and describe more in detals what You see . 3) Dimensional stability . Acrylic materials have wide range af thermal expansion coefficients . If You have a problem with " pick and place " , You have to put on YOUR requirements for final mechanical dimensions of the panels . Use fiducial points as much You can . 4 ) Flexibles are sensitive to moisture . Pre-bake it . I do not think it will help You , but at list will give You some idea . Regards and good lack . Edward Szpruch Eltek Ltd - Israel Tel 972 3 9395050 Fax 972 3 9309581 E-mail : [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################