Check you resist stripper dosing. Over-dosing here may cause high pH, which will cause breakdown of SnPb but remain quite invisible until after the etcher. This is MHO, does not reflect the opinion of my company. ytg ______________________________ Reply Separator _________________________________ Subject: [TN] Tin/Lead peeling off Author: "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask] at corp Date: 3/31/98 12:15 AM Hallo all; I need help to solve the problem of Tin/Lead peeling off during ecthing process. Tin/Lead alloy is used as ecth resist in our pattern plating line utilizing LeaRonal Plutin LA process. The plating time is 7.5min. and Current Density is 1.8~2.0A/dm2, then the resist layer is about 6~8um thick. Seldom did we find poor plating after pattern plating. But just after ecthing, you can see copper exposure in some pads or circuit, sometimes it is even worse to find open circuits or pin holes. The ratio of this kind of problem(referring boards) is about 3%. Sometimes when we do Hull Cell, the test panel looks dark in high current density area, sometimes it looks quite good. But the problem happens all the same. Also we have checked the PH and Cl content of etch solution, it seems OK. Can anybody offer suggestions to eliminate this problem? Thanks in advance. Ji Jiancheng ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################