Hello all, Our standard solderability test for HASL or Reflowed Tin-Lead finish is 5 seconds at 235 C (455 F) using non-activated SM/NA Flux on a static solder bath. We are seeing odd instances of missed pads on Electroless Nickel/Immersion Gold finish where the solder has not touched the pad at all. This only occurs on random isolated pads, sometimes one in a row of SMD pads, and I am wondering whether the test parameters should be slightly different for this finish or if there is a problem with the test rig. The majority of pads have tinned and solderability on these is very good. Any input on test parameters used elsewhere would be appreciated. -- Paul Gould [log in to unmask] Isle of Wight,UK ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################