We have a small docking PCB with four contact pads, plated with
electrolytic gold. The pins which make contact with the pads are quite
sharp and after a period of time are penetrating the gold, through the
copper and into the FR4. To prolong the time I have suggested making the
gold and copper thicker, but is any body aware of alternative materials
to hard gold and/or copper that would be suitable for this kind of
application ie something that would provide a harder contact surface.
Any suggestions would be extremely welcome.

Thanks in advance,

Adam Hawes (GenRad Ltd)

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