We have a small docking PCB with four contact pads, plated with electrolytic gold. The pins which make contact with the pads are quite sharp and after a period of time are penetrating the gold, through the copper and into the FR4. To prolong the time I have suggested making the gold and copper thicker, but is any body aware of alternative materials to hard gold and/or copper that would be suitable for this kind of application ie something that would provide a harder contact surface. Any suggestions would be extremely welcome. Thanks in advance, Adam Hawes (GenRad Ltd) ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################