Hi all, I finally break my silence..(well except for a few mis-sent listserv messages.... :) I work with advanced packaging concepts and we are looking at taking several Chip Scale Packages (pkgs only approximately 20% larger than the bare die themselves) and placing them on a small prototype circuit board. These CSP packages have 20-mil pitch uBGA balls as I/O and I'm curiously concerned about the ability to place these devices on a circuit board with the fine pitch. I was wondering if anyone could comment on any of their experiences with CSP packages, particularly from an I/O pitch, reliability or production (low quantity) feasibility aspect. Basically, I'm just looking for a better understand of what's been done with CSPs, what potential problems might be encountered in using them and what level of PCB technology is needed to accommodate these devices. Thanks, Bill William G. Brown MCMs & Electronic Packaging Sanders, A Lockheed Martin Co. PH (603) 885-3704 FX -7623 =-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-= Through the door of endless time We fall beyond the burning sky Like clouds that ever sink behind The crimson horizon's fading line ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################