I would sincerely appreciate some discussion on "preferred" plating
composition on fine pitch quad flat pack device leads from the
standpoint of SMT manufacturing (i.e. solderability and yields).  My
client is using what appears to be an electroplated 90Sn-10Pb
composition.  My suggestion was to use a composition close to the
eutecic composition (63Sn-37Pb).  Does anyone know of any IPC (or other)
specifications that address this topic?

Thanks,
Ed
--
               SEM Lab, Inc.
Scanning Electron Microscopy and Failure Analysis
               Snohomish, WA
               (425)335-4400
   http://www.eskimo.com/~eriemer/SEMLab.htm

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