Try assembly.net and smtnet.com. Thanks, Kathy Palumbo > ---------- > From: Paul Terranova[SMTP:[log in to unmask]] > Sent: Wednesday, March 18, 1998 7:10 AM > To: [log in to unmask] > Subject: Re: [TN] leadframe materials > > Jan, > > Is there really a Chipnet? How can those of us interested subscribe to > this forum? I've been looking for other forums similar to Technet > related to the microelectronics industry. If anyone else has any other > good recommendations, please let me know. Thanks. > > Paul Terranova > Analytical and Environmental Test Services Lab > Worldwide Module Components Group > > Digital Equipment Corp > 200 Forest Street > Mail Stop: MRO3-1/D2 > Marlboro, MA 01752-3085 > > ' Phone: (508)467-3109 > * Fax: (508)467-6796 > * Email: [log in to unmask] > > -----Original Message----- > From: Jan Vercammen [SMTP:[log in to unmask]] > Sent: Monday, March 16, 1998 9:16 AM > To: [log in to unmask] > Subject: [TN] leadframe materials > > hello, > > I have a few questions concerning package leadframe materials > of > integrated > circuit packages. I have subscrided only recently to ChipNet > and > I will > submit the same questions there. However, some of the > subscribers on TechNet > may have valuable info on the subject. > > -1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 > which > are Fe-Ni > alloys) still used alot for leadframe design of surface > mount devices? > What is the percentage of copper leadframes on the market > today? > -2- is there a finish used for copper leadframes and, if so, > what materials > are used and what is the covered thickness? > -3- who has information on or can list references or > literature > on the complex > permeability of non-copper leadframe materials ( > (e.g.Invar, > Kovar or > Alloy-42) > > All help, however small is appreciated. > > > regards, > > Jan Vercammen > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using > LISTSERV 1.8c > > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] > with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for > additional information. > For the technical support contact Dmitriy Sklyar at > [log in to unmask] or 847-509-9700 ext.311 > > ################################################################ > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for > additional information. > For the technical support contact Dmitriy Sklyar at [log in to unmask] or > 847-509-9700 ext.311 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################