Sean, I ask that you refer to page v in the forward, top of the right column in bold. "J-STD-001 establishes the minimum acceptability requiremnts for printed board assemblies soldering. This document, IPC-A-610, when addressing soldring is a companion and complimentary document, providing pictgorial interpretation of the requirements of J-STD-001. . . " In J-STD-001B Table 11-1 Hardware Defects, defect number 20 is "Fractured, distrubed, cold, or excess solder connections (see 9.2.4.1.) J-STD-001 Clause 9.2.4.1 Solder Connection Defects states in part "The following solder joint conditions MUST be considered defects: a. Franctured solder connections b. Distrubed solder connections" A fractured solder joint as depicted in IPC-A-610 Figure 4-21, whether caused by mechical shock from trimming as indicated in 610 Clause 4.2.2 or from the stress of bending the lead and tearing away from the solder fillet is still a "fractured or disturbed solder joint." Another applicable area of 610 is 4.1 under Figure 4-1 which states in part that an acceptable solder fillet ". . . exhibits good wetting of the solder to the parts being joined." This is repeated under 610 Figure 4-3 (and J-STD-001B clause 9.2.4) "The acceptable solder connection MUST indicate evidence of wetting and adherence when the solder blends to the soldered surface. . ." You indicate that the solder is tearing away from the leads when you bend them; they may not have good wetting and don't seem to have adherence. I'm sure the question most readers have is that, knowing that mechanical stress in a solder connection WILL have deleterious effects, why haven't you taken action to stabilize the lead before soldering? The stress that you are leaving in those connections, even though you may not see the damage now at 3X is quite likely to rear its uggle head in the not too distant future. I've info'd the leaders of the IPC-A-610 and J-STD-001 task groups; they may have additional comments to add. Jack Jack Crawford, IPC Project Manger - Assembly 2215 Sanders Road, Northbrook IL 60062-6135 [log in to unmask] http://www.ipc.org 847-509-9700 x 393 fax 847-509-9798 >>> Sean Hager <[log in to unmask]> 03/17/98 06:18PM >>> Greetings, Please assist in questions with 610 interpretaion: 4.2.2 - Nonconforming Defect - Class 1,2,3 - Evidence of fracture between lead and solder fillet. How does this requirement apply to leads that are NOT trimmed? The way I read it, this requirement is under the "Trimmed Lead" Section of the Soldering requirements. We have seen untrimmed leads that have evididence of a small seperation between the top of the fillet and the lead face when slightly bent. We have attempted to minimize this bending, but have not successfullly eliminated it. I would tend to think that the stresses on the fillet from a slight bend are far less than those caused by the shock of a cut. Nonconforming Defect: Yes or No? If nonconforming, is 4.2.2 the location of the definition by which it is nonconforming? If nonconforming, will rework result in superior solder fillet reliability (compared to Use As Is)? For that matter can a Nonconforming Defect (according to strict interpretation) be dispositioned UAI based on a judgement of defect severity? (i.e. 5.2 Nonconforming Defect - 1,2,3, - Assemblies shall be free of dirt, lint,dross,etc. - Does this mean that even a single piece of particulate matter is rejectable? Again I am assuming that this takes the definition to far, and the intent is simply clean boards. ) The foreward of 610 only mentions rework, repair, or scrap as options under Nonconforming. (BTW: since not trimmed, these leads do not get inspected at 10X. Some inspectors claim the fractures are not obvious under normal inspection magnification - 3 Diopter) This turned out kind of long so I will save other questions for my next Email. Thanks in advance and good day! Sean Hager ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################