Michael, Coming from the ICT field and not much experience from the SM field, I will suggest the following,...of course at the board design level of things which doesn't help you too much but maybe it can help. Not knowing the board layout, I would say that it is a better bet to design in test pads for the pins as opposed to trying to deal with the pin shape and via's. I wonder if the ICT equipment is set up for Clam Shell type fixtures? These tend to help. Richard Hamilton Clemar Mfg. / Rain Bird [log in to unmask] > -----Original Message----- > From: MICHAEL DODSON [SMTP:[log in to unmask]] > Sent: Monday, March 09, 1998 8:41 AM > To: [log in to unmask] > Subject: [TN] Vias filled with solder for ICT testing > > Hello, > > Searching for feedback on the requirements for ICT testing. > > a.) Do the vias need to be filled with solder? > b.) Do the probes need to make contact with the center of the via > or should the probe contact the via pad only? > > I have a customer who is requiring the solder side vias be filled > with solder and the component side vias plugged with mask. I've > explained that via plugging with mask is not an issue, but I can not > guarantee 100% solder filled vias after HASL. The customer is telling > me their ICT test fixture needs to probe the center of the via. > (10 layer board / double sided SMT's) > > What is your experience and advice? > > Michael Dodson > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for > additional information. > For the technical support contact Dmitriy Sklyar at [log in to unmask] or > 847-509-9700 ext.311 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################