Ed,

Don't know if they meet your definition of production but, in
'72,'73,'74 on both gold plated boards and thick film substrates did
Chip Resistors, Chip Capacitors Beam Lead bonding, Flatpacks, custom
Ceramic Packages from Kyrocera (sp?), TAB, and COB. Can't say they were
high volume production, but we did sell some for medical products and
military proto's. Also probably didn't follow modern SMT pad design (or
even modern design guidelines) at that time.
Semper Fi
Tom

>
>Can someone tell me the time frame when surface mount technology started
>being used in production. this to settle a friendly debate, sort of  a memory
>challenge  you might say.  I don't seem to recall seeing SMT pads on boards
>before 1982-84 time frame ( maybe even later) . A friend of mine seems to
>think they where in use in the 70s. Fact is I really don't know when they
>started showing up on designs.  God I think I losing it!  Must be getting
>old...hehe..
>
>

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