We are setting up a R & D facility which will be involved in MCM-L fabrication and chip scale packaging techniques. Our immediate concern is an Exposure unit capable of doing .003" lines/spaces in resists .001 - .0015" thk., and also capable of exposing .004" dia. vias in a photodefined dielectric. I would appreciate any recommendations regarding equipment specifications and processing tips. NOTE: Speed of processing is not a requirement and I would like to stay away from the high power(7/8 kw) units that require chillers or some additional cooling scheme. Thank you for your consideration and time ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################