Great Question! IPC sponsors additional FREE technical forums run on our LISTSERV system. Full descriptions are available from our web site http://www.ipc.org Scroll down to the IPC On-Line Services icon on the left side and that will take you to the right place. Abbreviated info follows: TechNet: used to ask others for technical help, comments or questions on IPC specifications, or other technical inquiries. Designer Council: means to stay current with the many programs of the IPC Designers Council, and to exchange information with other designers. ComplianceNet: covers environmental, safety and related regulations or issues, regulatory proposals, alerts and draft comments, legislative updates, new regulatory interpretations (i.e., photo resist skins), Grass roots action alerts, compliance assistance IPCsm840: very specific; comment, help or get help on issues relating to "Qualification and Performance Specification of Permanent Polymer Coating (Soldermask) for Printed Boards." ChipNet: very specific, comment, help or get help on issues relating to ANSI/J-STD-012, "Implementation of Flip Chip and Chip Scale Technology." Roadmap: very specific, provides opportunity for information exchange that facilitates coordinated development of IPC's National Technology Roadmap for Electronic Interconnections. IPC_New_Releases: Provides notification to subscribers when new and revised IPC publications are available. GenCAM: used for comments or questions on IPC's effort to standardize electronic data transfer strategies (DTS) and other inquiries regarding transferring files from CAD to CAM. IPC will also use GenCAM to announce meetings, important technical issues, new developments, etc. Jack Crawford, IPC Project Manger - Assembly 2215 Sanders Road, Northbrook IL 60062-6135 [log in to unmask] http://www.ipc.org 847-509-9700 x 393 fax 847-509-9798 >>> Paul Terranova <[log in to unmask]> 03/18/98 09:10AM >>> Jan, Is there really a Chipnet? How can those of us interested subscribe to this forum? I've been looking for other forums similar to Technet related to the microelectronics industry. If anyone else has any other good recommendations, please let me know. Thanks. Paul Terranova Analytical and Environmental Test Services Lab Worldwide Module Components Group Digital Equipment Corp 200 Forest Street Mail Stop: MRO3-1/D2 Marlboro, MA 01752-3085 ' Phone: (508)467-3109 * Fax: (508)467-6796 * Email: [log in to unmask] -----Original Message----- From: Jan Vercammen [SMTP:[log in to unmask]] Sent: Monday, March 16, 1998 9:16 AM To: [log in to unmask] Subject: [TN] leadframe materials hello, I have a few questions concerning package leadframe materials of integrated circuit packages. I have subscrided only recently to ChipNet and I will submit the same questions there. However, some of the subscribers on TechNet may have valuable info on the subject. -1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which are Fe-Ni alloys) still used alot for leadframe design of surface mount devices? What is the percentage of copper leadframes on the market today? -2- is there a finish used for copper leadframes and, if so, what materials are used and what is the covered thickness? -3- who has information on or can list references or literature on the complex permeability of non-copper leadframe materials ( (e.g.Invar, Kovar or Alloy-42) All help, however small is appreciated. regards, Jan Vercammen ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################