hello,

I have a few questions concerning package leadframe materials of integrated
circuit packages. I have subscrided only recently to ChipNet and I will
submit the same questions there. However, some of the subscribers on TechNet
may have valuable info on the subject.

-1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which are Fe-Ni
    alloys) still used alot for leadframe design of surface mount devices?
    What is the percentage of copper leadframes on the market today?
-2- is there a finish used for copper leadframes and, if so, what materials
    are used and what is the covered thickness?
-3- who has information on or can list references or literature on the complex
    permeability of non-copper leadframe materials ( (e.g.Invar, Kovar or
    Alloy-42)

All help, however small is appreciated.


regards,

Jan Vercammen

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