WE NEED MORE INFORMATION! Are the traces in low-density areas, with other areas of high density not exhibiting the problem? Are the problems due to nodules or spikes, or are they low-current or high-current burning? Is this problem only on circuits?-what about in the holes or on the pads? WE NEED MORE INFORMATION! Fred J. >>> Padmanabha Anandapuram Halappa <[log in to unmask]> 03/05/98 01:19pm >>> dear technet plating engineers, need to know how to overcome grainy copper deposit & dendrite copper growth in acid copper plating.Dendrite grows at track edge & shorts with neighbouring track. Does acid dip before copper plating with copper contamination about 100 ppm can cause this. thanks. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################