Hello TechNet,

I have a few questions about acid copper plating mainly pretaining to
distrubutionon the panel.

1)What is the major differances between slab anodes and nuggets,
pros/cons?

2)Is there an optimum agitation speed or stroke length thatcopper plating
is done at, cathode to anode 8" on center.

3)Does anyone use non-air sparged plating, any pros/cons?

One not related to copper plating:

Does any one have any info. on what the conductivity levels for the
rinse tanks in a electroless copper plating line should be?
Any other info. on plating distrubution welcome.
Thanks in advance!

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