Hello TechNet, I have a few questions about acid copper plating mainly pretaining to distrubutionon the panel. 1)What is the major differances between slab anodes and nuggets, pros/cons? 2)Is there an optimum agitation speed or stroke length thatcopper plating is done at, cathode to anode 8" on center. 3)Does anyone use non-air sparged plating, any pros/cons? One not related to copper plating: Does any one have any info. on what the conductivity levels for the rinse tanks in a electroless copper plating line should be? Any other info. on plating distrubution welcome. Thanks in advance! ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################