John Riley wrote: > > IPC has joined forces with SMTA, IMAPS and the Chip Scale Review Magazine to create a > world-class technical forum on the development and application of chip scale > packaging technologies. > > Papers and half-day workshops are sought on all aspects of CSP and other high density > packaging methodologies. Information on board level and circuit design issues are of > particular interest, since substrates are becoming the most technologically critical > aspect of successful CSP adoption. > > Tuesday, May 5, will be devoted to half-day workshops. Technical sessions will follow > on May 6 and 7. The Chip Scale International 98 Exhibition opens on Wednesday, May 6. > > The technical program will address device level packaging and microelectronics, > circuit design and fabrication, and board/module level assembly processes. Paper > topics covering product applications, materials , processes and equipment, test > methods, reliability and performance data will be considered. > > The deadline for abstract submission is February 27, 1998. The deadline for paper > and/or presentation materials is March 27, 1998. Printed materials are mandantory in > order to present at the conference. Presentations must be non-commercial in nature, > focusing on technology rather than a company's product. All presenters will receive > full conference admission at no charge. There will be an honorarium and travel > expenses covered for workshop presenters. > > To submit an abstract, please provide your name, address (including e-mail), and a > 200-300 word description along with a brief biography. Please send to John Riley, IPC > Director of Education, > by e-mail: [log in to unmask] or fax: 847/509-9798. > Also, please indicate if the submission is for the technical program or for a > workshop. If it is a technical paper, please indicate the desired time (30, 45, or 60 > minutes). > > This is a tremendous opportunity to learn and contribute your expertise to one of the > most exciting developments in the electronics industry. > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. > For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 > ################################################################ ok ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################